| Process capacity parameter table（2019.02） | ||||
| Serial number | Entry name | Template ability（≤3m2） | Medium and small batch production capacity（≤20m2) | |
| 1 | Material type | Ordinary Tg FR4 | Benefit S1141 KB6160 | Benefit S1141 KB6160 |
| 2 | In TG | Benefit KB6165 IT158 | Benefit KB6165 IT158 | |
| 3 | Ordinary Tg FR4（Halogen free） | Benefit S1150G Union Mao：IT | Benefit S1150G | |
| 4 | High TG FR-4（Halogen-free） | Benefit S1165 Union Mao：IT | Benefit S1165 | |
| 5 | High TG FR-4 | Shengyi s1170 Shengyi s1000-2 kb6167 kb6168 Lianmao: it180a (preferred) | Benefit S1170 Benefit S1000-2 KB6167 KB6168 Union Mao：IT180A | |
| 6 | High CTI（≥600） | Benefit S1600 KB7150 C | Benefit S1600 KB7150 C | |
| 7 | The minimum thickness of the medium layer of multilayer board is 0.26mm + / -0.05mm (currently, only 7628 PP sheets with high CTI are used, so 7628 + 1080 combination is needed) | The minimum thickness of the medium layer of multilayer board is 0.26mm + / -0.05mm (currently, only 7628 PP sheets with high CTI are used, so 7628 + 1080 combination is needed) | ||
| 8 | Ceramic filled high frequency plate | Rogers4000 series rogers3000 series (unlimited for 2-layer board and 3M2 for 4-layer board | Rogers4000 series rogers3000 series (limited to 2 layers) | |
| 9 | Polytetrafluoroethylene high frequency plate | Taconic series, Arlon series, nelco series, Taizhou netling f4bk and TP series (unlimited 2-layer board and 3M2 4-layer board | Taconic series, Arlon series, nelco series, Taizhou netling f4bk, TP series (limited to 2 layers) | |
| 10 | Mixed material | Rogers4000 series + FR4 + rogers3000 series + FR4 + aluminum base | Rogers40000+FR4 Rogers300004+FR4 | |
| 11 | Number of floors: < 8 | Number of floors: < 8 | ||
| 12 | PP limited to ordinary high Tg FR4 (if Rogers PP is required, it shall be provided by the customer) | / | ||
| 13 | Metal matrix | Single copper base, single aluminum base | Single copper base, single aluminum base | |
| 14 | Product type | Extra thick copper | Mechanical blind hole, ultra thick copper, semiconductor test board | Mechanical blind hole, ultra thick copper, semiconductor test board |
| 15 | Multilayer press fit blind hole | Pressing on the same side ≤ 4 times | Pressing on the same side ≤ 2 times | |
| 16 | HDI board type | 1+N+1 、 2+N+2 | 1+N+1 | |
| 17 | Layer number | Ordinary FR4 high TG | 1-22 floors (10 floors and above must use high Tg) | 1-18 floors (10 floors and above must use high Tg) |
| 18 | Surface treatment | Surface treatment type (lead-free) | Lead free tin spray, gold deposit, silver deposit, tin deposit, OSP, nickel deposit and palladium deposit, electroplated hard gold, electroplated gold finger (including segmented gold finger), gold deposit + OSP, gold deposit + electroplated gold finger, tin deposit + electroplated gold finger, silver deposit + electroplated gold finger | Lead free tin spray, gold deposit, silver deposit, tin deposit, OSP, nickel deposit and palladium deposit, electroplated hard gold, electroplated gold finger (including segmented gold finger), gold deposit + OSP, gold deposit + electroplated gold finger, tin deposit + electroplated gold finger, silver deposit + electroplated gold finger |
| 19 | Surface treatment type (with lead) | Lead tin sprayed | Lead tin sprayed | |
| 20 | Spray tin + gold finger: spray tin pad to gold finger spacing | 3mm | 3mm | |
| 21 | Finished product size（MAX) | There are 22 "(558mm) * 40" (1016mm) lead-free tin spraying 22 "(558mm) * 40" (1016mm), 24 "(609mm) * 24" (609mm) * 24 "(609mm), 24" (609mm) * 24 "(609mm), 21" (530mm) * 27 "(685mm), 16" (406mm) * 21 "(533mm), 18" (457mm) * 18 "(457mm), osp24" (609mm) * 40 "(1016mm) nickel and palladium 21" (530mm) * 27 "(685mm) deposition | There are 22 "(558mm) * 24" (610mm) lead-free tin spraying 22 "(558mm) * 24" (610mm), 21 "(530mm) * 24" (610mm) chemical gold deposition, 16 "(406mm) * 21" (533mm), 18 "(457mm) * 18" (457mm), osp22 "(558mm) * 24" (610mm), 21 "(530mm) * 24" (610mm) nickel and palladium deposition | |
| 22 | Finished product size（MIN) | There are 0.2 "(5mm) * 0.2" (5mm) lead-free tin spray, 0.2 (5mm) "* 0.2" (5mm) lead-free tin spray, 1.6 "(40mm)" 1.6 "(40mm) electroplated gold fingers, 0.2" (5mm) "0.2" (5mm) electroplated hard gold, 0.2 "(5mm)" 0.2 "(5mm) chemical gold deposition, 0.2" (5mm) "* 0.2" (5mm), 2 (50mm) "4" (100mm) tin deposition, 2 (50mm) "4" (100mm) silver deposition, 50 "(100mm) osp2" (50mm) "4" (100mm), 0.2 (5mm) "palladium nickel deposition, 0.2" (5mm) and * 0.2 "(5mm) the minimum size must be assembled Make, mosaic size ≥ 80 * 100mm | There are lead spray tin 2 "(50mm) * 2" (50mm), lead-free spray tin 2 "(50mm) * 2" (50mm), chemical deposition gold 2 "(50mm) * 2" (50mm), Deposition TiN 2 (50mm) "* 4" (100mm), deposition Silver 2 "(50mm) * 4" (100mm), osp2 "(50mm) * 4" (100mm) deposition nickel palladium 2 "(50mm) * 2" (50mm) | |
| 23 | Processing plate thickness | (it is recommended to send out and damage the plate thickness exceeding 4.0mm Damage to the horizontal line will lead to difficulties in subsequent production of high and multi-layer core boards) | Lead free spray tin 1.0-4.0mm, lead spray tin 1.0-4.0mm, gold deposition 0.6-4.0mm, silver deposition 1.0-4.0mm, tin deposition 1.0-4.0mm, osp1.0-4.0mm, nickel deposition palladium 0.6-4.0mm (it is recommended to send out when exceeding 4.0mm plate thickness, damaging water Flat line, which will lead to difficulties in subsequent production of high and multi-layer core board) | |
| 24 | Surface treatment thickness | Tin spraying | 2-40um (the thinnest thickness of the large tin surface with lead spray (tin surface size ≥ 20 * 20MM) is 0.4um, and the thinnest thickness of the large tin surface without lead spray (tin surface size ≥ 20 * 20MM) is 1.5um | 2-40um (the thinnest thickness of the large tin surface with lead spray (tin surface size ≥ 20 * 20MM) is 0.4um, and the thinnest thickness of the large tin surface without lead spray (tin surface size ≥ 20 * 20MM) is 1.5um |
| 25 | OSP | Film thickness: 0.2-0.3um | Film thickness: 0.2-0.3um | |
| 26 | Sunk gold | Gold thickness: 0.025-0.1um, Nickel thickness: 3-8um | Gold thickness: 0.025-0.1um, Nickel thickness: 3-8um | |
| 27 | Immersion silver | Silver thickness：0.2-0.4um | Silver thickness: 0.2-0.4um | |
| 28 | Tin precipitation | Tin thickness：0.8-1.5um | Tin thickness: 0.8-1.5um | |
| 29 | Electroplating hard gold | Jin Hou：0.1-1.3um | Gold thickness: 0.1-1.3um | |
| 30 | Nickel palladium | Nickel thickness: 3-8um; palladium thickness: 0.05-0.15um; gold thickness: 0.05-0.1um | Nickel thickness: 3-8um; palladium thickness: 0.05-0.15um; gold thickness: 0.05-0.1um | |
| 31 | Carbon oil | 10-50um（Carbon oil with resistance value cannot be produced） | 10-50um（Carbon oil with resistance value cannot be produced） | |
| 32 | When there are (crossing) lines under the carbon reservoir | Two resistance welding | Two resistance welding | |
| 33 | Blue gum | Thickness: 0.2-0.5mm conventional model: peters2955 | Thickness: 0.2-0.5mm conventional model: peters2955 | |
| 34 | 3M tape | 3M brand | 3M brand | |
| 35 | High temperature adhesive tape | Thickness：0.03-0.07mm | Thickness：0.03-0.07mm | |
| 36 | Drill hole | Maximum plate thickness of 0.15mm mechanical drilling | 1.0mm | 0.6mm |
| 37 | Maximum plate thickness of 0.2mm mechanical drilling | 2.0mm | 1.6mm | |
| 38 | Hole position tolerance of mechanical hole | +-3mil | +-3mil | |
| 39 | Diameter of finished mechanical hole | The minimum diameter of metallized half hole is 0.3mm | The minimum diameter of metallized half hole is 0.5mm | |
| 40 | PTFE material (including mixed pressure) plate with a minimum finished aperture of 0.25mm | Minimum finished aperture of PTFE material (including mixed pressure) plate is 0.3mm | ||
| 41 | Minimum finished metal base aperture 1.0mm | / | ||
| 42 | Ceramic filled high frequency plate (including mixed pressure): 0.25mm | Ceramic filled high frequency plate (including mixed pressure): 0.25mm | ||
| 43 | Mechanical through-hole maximum: 6.5mm over 6.5mm, use reaming method, hole diameter tolerance + - 0.1mm | Mechanical through-hole maximum: 6.5mm, larger than 6.5mm, hole diameter tolerance + - 0.1mm | ||
| 44 | Mechanical blind hole diameter ≤ 0.3mm | Mechanical blind hole diameter ≤ 0.3mm | ||
| 45 | Through hole plate thickness diameter ratio is the largest | 10 ：1（Boards over 10:1 need to be manufactured according to our company's structure） | 8 : 1 | |
| 46 | The ratio of depth to diameter of blind hole in mechanical depth control drilling | 1 ：1 | 0.8 ： 1 | |
| 47 | Minimum distance from inner hole of mechanical drill to line (original document) | 4 Layer：6mil | 4 Layer：7mil | |
| 48 | 6 Layer：7mil | 6 Layer： 8mil | ||
| 49 | 8 Layer：8mil | 8 Layer： 9mil | ||
| 50 | 10 Layer: 9mil | 10 Layer：10mil | ||
| 51 | 12 Layer：9mil | 12 Layer：12mil | ||
| 52 | 14 Layer：10mil | 14 Layer：14mil | ||
| 53 | 16 Layer：12mil | / | ||
| 54 | Minimum distance from inner layer hole to line of mechanical drilling blind hole (original document) | Primary compression: 8mil | Primary compression: 10mil | |
| 55 | Secondary compression: 10mil | Secondary compression: 14mil | ||
| 56 | Triple compression: 16mil | / | ||
| 57 | Minimum distance between different network hole walls | 10mil (after compensation) | 12mil (after compensation) | |
| 58 | Minimum distance between holes in the same network | 6mil (after compensation) | 8mil (after compensation) | |
| 59 | Npth hole diameter tolerance minimum | ±2mil | ±2mil | |
| 60 | Diameter accuracy of crimping hole | ±2mil | ±2mil | |
| 61 | Tolerance of step hole depth | ±6mil | ±6mil | |
| 62 | Taper hole depth tolerance | ±6mil | ±6mil | |
| 63 | Hole diameter tolerance of tapered hole | ±6mil | ±6mil | |
| 64 | Minimum diameter of PGA hole | 0.25mm | / | |
| 65 | Taper hole angle and tolerance | Angle: 82 °, 90 °, 100 °; angle tolerance + / - 10 ° | Angle: 82 °, 90 °, 100 °; angle tolerance + - 10 ° | |
| 66 | Minimum groove diameter (finished product) | PTH Groove：0.4mm；NPTH Groove：0.5mm | PTH Groove：0.4mm；NPTH Groove：0.5mm | |
| 67 | Diameter of resin plug hole in disc hole (drilling tool) | 0.15-0.65mm（Plate thickness range：0.4-3.2mm) | 0.15-0.65mm（Plate thickness range：0.4-3.2mm) | |
| 68 | Electroplated hole filling diameter (drill) | 0.15-0.3mm （Plate must be high TG) | / | |
| 69 | Hole copper thickness | Mechanical blind hole 18-20um, mechanical through hole: 18-25um | Mechanical blind hole 18-20um, mechanical through hole: 18-25um | |
| 70 | Mechanical plug-in hole: 18-35um | Mechanical insert hole：18-35um | ||
| 71 | Pad (ring) | Minimum size of inner and outer pads of mechanical hole (single side) | Base copper 1 / 3oz, minimum after through hole compensation: 3mil, minimum after plug-in hole compensation: 4mil | Base copper 1 / 3oz, minimum after through hole compensation: 4mil, minimum after plug-in hole compensation: 5MIL |
| 72 | Base copper 1 / 2oz, minimum after through hole compensation: 3mil, minimum after plug-in hole compensation: 5MIL | Base copper 1 / 2oz, minimum after through hole compensation: 4mil, minimum after plug-in hole compensation: 6mil | ||
| 73 | Base copper 1 / 1oz, minimum after through hole compensation: 5MIL, minimum after plug-in hole compensation: 6mil | Base copper 1 / 1oz, minimum after through hole compensation: 5MIL, minimum after plug-in hole compensation: 6mil | ||
| 74 | BGA pad diameter minimum (original) | Finish copper thickness 1 / 1oz: Tin spray plate min 10mil; other process plates min 8mil | Finish 1 / 1oz of copper thickness: minimum 12mil for tin spray plate; minimum 10mil for other process plates | |
| 75 | Finish copper thickness 2 / 2oz: spray tin plate with a minimum of 14mil; other process plates with a minimum of 10mil | Finish 2 / 2oz copper thickness: minimum 14mil for tin spray plate; minimum 12mil for other process plates | ||
| 76 | Line width and line spacing (original) | Inner layer | 1/2OZ：3/3mil | 1/2OZ：4/4mil |
| 77 | 1/1OZ：3/4mil | 1/1OZ：5/5mil | ||
| 78 | 2/2OZ：5/5mil | 2/2OZ：6/6mil | ||
| 79 | 3/3OZ：5/8mil | 3/3OZ：5/9mil | ||
| 80 | 4/4OZ：6/11mil | 4/4OZ：7/12mil | ||
| 81 | 5/5OZ：7/14mil | 5/5OZ：8/15mil | ||
| 82 | 6/6OZ：8/16mil | 6/6OZ：10/18mil | ||
| 83 | Outer layer | 1/3OZ：3/3mil Line density: the proportion of 3mil line to the whole surface (including copper surface, base material and line) is ≤ 10% | / | |
| 84 | 1/2OZ：3/4mil Line density: the proportion of 3mil line to the whole surface (including copper surface, base material and line) is ≤ 10% | 1 / 2oz: 4 / 4mil line density: the proportion of 3mil line to the whole surface (including copper surface, base material and line) is ≤ 20% | ||
| 85 | 1/1OZ：4.5/5mil | 1/1OZ：5/5.5mil | ||
| 86 | 2/2OZ：6/7mil | 2/2OZ：6/8mil | ||
| 87 | 3/3OZ：6/10mil | 3/3OZ：6/12mil | ||
| 88 | 4/4OZ：8/13mil | 4/4OZ：8/16mil | ||
| 89 | 5/5OZ：9/16mil | 5/5OZ：9/20mil | ||
| 90 | 6/6OZ：10/19mil | 6/6OZ：10/22mil | ||
| 91 | 7/7OZ：11/22mil | 7/7OZ：11/25mil | ||
| 92 | 8/8OZ：12/26mil | 8/8OZ：12/30mil | ||
| 93 | 9/9OZ：13/30mil | 9/9OZ：13/32mil | ||
| 94 | 10/10OZ：14/35mil | 10/10OZ：14/35mil | ||
| 95 | 11/11OZ：16/40mil | 11/11OZ：16/45mil | ||
| 96 | 12/12OZ：18/48mil | 12/12OZ：18/50mil | ||
| 97 | 13/13OZ：19/55mil | 13/13OZ：19/60mil | ||
| 98 | 14/14OZ：20/60mil | 14/14OZ：20/66mil | ||
| 99 | 15/15OZ：22/66mil | 15/15OZ：22/70mil | ||
| 100 | 16/16OZ：22/70mil | 16/16OZ：22/75mil | ||
| 101 | Line width tolerance | 6-10mil：+/-10% 6mil以下+-1mil | ≤10mil：+/-20% | |
| 102 | >10mil：+/-15% | >10mil： +/-20% | ||
| 103 | Yin-Yang copper | 18/35、35/70、18/70、35/105、70/105 | 18/35、35/70、18/70、35/105、70/105 | |
| 104 | Solder stop / character | Color of solder resist ink | Green, yellow, black, blue, red, gray, white, purple, orange, dumb green, dumb black, dumb blue, coffee, transparent oil | Green, yellow, black, blue, red, white, purple, orange, dumb green, dumb black, dumb blue, transparent oil |
| 105 | Mixing of various inks | One layer of resistance welding two kinds of ink, two layers of each one kind of ink | Two layers of each ink | |
| 106 | Maximum plug hole diameter of solder resist ink (drill diameter) | 0.8mm | 0.5mm | |
| 107 | Character ink color | White, black, yellow, gray, blue, red, green | White, black, yellow, gray, blue, red, green | |
| 108 | Character height / width | 28*4mil | 28*4mil | |
| 109 | Resistance welding window opening | Unilateral 1mil | Unilateral 3mil | |
| 110 | Alignment of solder mask | +/-2mil | +/-3mil | |
| 111 | Minimum width / height of solder mask negative characters | White, black, yellow, gray, blue, red, greenTin spray plate: 0.3mm * 0.8mm, other plates: 0.2mm * 0.8mm | Tin spray plate: 0.3mm * 0.8mm, other plates: 0.2mm * 0.8mm | |
| 112 | Solder resist Bridge | White, black, yellow, gray, blue, red, greenWhite, black, yellow, gray, blue, red, green：3mil | 4mil | |
| 113 | Dumb color: 4mil (dumb black must be 5MIL) | Matte: 5MIL (matte black must be 6mil) | ||
| 114 | Variegated ink: 5MIL | Variegated ink: 6mil | ||
| 115 | Appearance | External dimension tolerance | +-4mil | +-5mil |
| 116 | Minimum tolerance for slotted holes (PTH) | Groove length and width direction are + - 0.13MM | Groove length and width direction are + - 0.13MM | |
| 117 | Minimum tolerance for slotted holes (npth) | Groove length and width direction are + - 0.1mm | Groove length and width direction are + - 0.1mm | |
| 118 | Depth tolerance of controlled depth milling groove | +/-4mil | +-6mil | |
| 119 | Minimum distance from the minimum line to the outer edge of the Gong board | 8mil | 10mil | |
| 120 | Minimum distance from V-CUT center to line edge | T < = 0.4 mm angle 30 ° (minimum 0.25 mm) angle 45 ° (minimum 0.3 mm) angle 60 ° (minimum 0.4 mm) | T < = 0.4 mm angle 30 ° (minimum 0.25 mm) angle 45 ° (minimum 0.3 mm) angle 60 ° (minimum 0.4 mm) | |
| 121 | 0.4mm <T≤0.8mm Angle 30 ° (min 0.3mm) Angle 45 ° (min 0.35mm) Angle 60 ° (min 0.4mm) | 0.4mm <T≤0.8mm Angle 30 ° (min 0.3mm) Angle 45 ° (min 0.35mm) Angle 60 ° (min 0.4mm) | ||
| 122 | 0.8mm <T≤1.20mm Angle 30 ° (minimum 0.4mm) Angle 45 ° (minimum 0.45mm) Angle 60 ° (minimum 0.55mm) | 0.8mm <T≤1.20mm Angle 30 ° (minimum 0.4mm) Angle 45 ° (minimum 0.45mm) Angle 60 ° (minimum 0.55mm) | ||
| 123 | 1.20mm <T≤1.80mm Angle 30 ° (minimum 0.45mm) Angle 45 ° (minimum 0.50mm) Angle 60 ° (minimum 0.65mm) | 1.20mm <T≤1.80mm Angle 30 ° (minimum 0.45mm) Angle 45 ° (minimum 0.50mm) Angle 60 ° (minimum 0.65mm) | ||
| 124 | 1.80mm <T≤2.00mm angle 30 ° (minimum 0.50mm) angle 45 ° (minimum 0.55mm) angle 60 ° (minimum 0.70mm) | 1.80mm <T≤2.00mm angle 30 ° (minimum 0.50mm) angle 45 ° (minimum 0.55mm) angle 60 ° (minimum 0.70mm) | ||
| 125 | T ≥ 2.05mm, angle 30 ° (minimum 0.55mm), angle 45 ° (minimum 0.60mm), angle 60 ° (minimum 0.75mm) | T ≥ 2.05mm, angle 30 ° (minimum 0.55mm), angle 45 ° (minimum 0.60mm), angle 60 ° (minimum 0.75mm) | ||
| 126 | V-CUT angle specification | 20°、30°、45°、60° | 20°、30°、45°、60° | |
| 127 | V-CUT angle tolerance | +-5° | +-5° | |
| 128 | Golden finger chamfer angle | 20°、30°、45°、60° | 20°、30°、45°、60° | |
| 129 | Tolerance of chamfer depth of gold finger | +/-0.1mm | +/-0.1mm | |
| 130 | Angle tolerance of gold finger chamfer | +-5° | +-5° | |
| 131 | Minimum distance between V-CUT tools | 8mm | 8mm | |
| 132 | V-CUT plate thickness range | 0.4--3.0mm | 0.4--3.0mm | |
| 133 | V-CUT minimum thickness and tolerance | 0.4mm ≤ plate thickness ≤ 0.6mm residual thickness: 0.2 ± 0.1mm | 0.4mm ≤ plate thickness ≤ 0.6mm residual thickness: 0.2 ± 0.1mm | |
| 134 | 0.6mm ≤ plate thickness ≤ 0.8mm residual thickness: 0.35 ± 0.1mm | 0.6mm ≤ plate thickness ≤ 0.8mm residual thickness: 0.35 ± 0.1mm | ||
| 135 | 0.8mm ＜ plate thickness ＜ 1.6mm residual thickness: 0.4 ± 0.13MM | 0.8mm ＜ plate thickness ＜ 1.6mm residual thickness: 0.4 ± 0.13MM | ||
| 136 | Plate thickness ≥ 1.6mm residual thickness: 0.5 ± 0.13MM | Plate thickness ≥ 1.6mm residual thickness: 0.5 ± 0.13MM | ||
| 137 | Plate thickness and tolerance | Minimum plate thickness | 1-layer plate: 0.15mm + - 0.05mm limit gold deposition process; single size limit: 300 * 300mm | 1-layer board: 0.3mm + - 0.1mm, gold deposit limit, OSP process, single size limit: 300 * 300mm |
| 138 | 2-layer plate: 0.2mm + - 0.05mm, limit gold deposition process, single size limit: 350 * 350mm | 2-layer plate: 0.3mm + - 0.1mm, gold deposit limit, OSP process, single size limit: 300 * 300mm | ||
| 139 | 4-layer plate: 0.4mm + - 0.1mm, limit gold deposition, OSP, tin deposition, silver deposition process, single size limit: 350 * 400mm | 4-layer plate: 0.8mm + - 0.1mm surface technology is not limited; single size is limited to 500 * 680mm | ||
| 140 | 6-layer plate: 0.6mm + - 0.1mm surface technology is not limited; single size is limited to 500 * 680mm | 6-layer plate: 1.0mm + - 0.13MM; surface technology is not limited; single size is limited to 500 * 680mm | ||
| 141 | 8-layer plate: 0.8mm + - 0.1mm surface technology is not limited; single size is limited to 500 * 680mm | 8-layer plate: 1.2mm + - 0.13MM; surface technology is not limited; single size is limited to 300 * 300mm | ||
| 142 | 10 layer board: 1.0mm + - 0.1mm surface technology is not limited; single size is limited to 400 * 400mm | 10 layer board: 1.4mm + - 0.14mm; surface technology is not limited; single size is limited to 300 * 300mm | ||
| 143 | 12 layer board: 1.4mm + - 0.13MM; surface technology is not limited; single size is limited to 350 * 400mm | 12 layer board: 1.6mm + - 0.16mm surface technology unlimited single size limited: 300 * 300mm | ||
| 144 | 14 layer plate: 1.6mm + - 0.13MM; surface technology is not limited; single size is limited to 350 * 400mm | 14 layer board: 1.8mm + - 0.18mm; surface technology is not limited; single size is limited to 300 * 300mm | ||
| 145 | 16 layer plate: 1.8mm + - 0.16mm; surface technology is not limited; single size is limited to 350 * 400mm | / | ||
| 146 | Other | Impedance | Impedance tolerance: inner layer + - 5%; outer layer + - 10% | Impedance tolerance: + - 10% |
| 147 | Single ended, coplanar, differential impedance combination: ≤ 10 groups | Less than 5 groups | ||
| 148 | Coil plate | No inductance required | No inductance required | |
| 149 | Single terminal resistance | Resistance tolerance + - 10% (limit + - 2%) | Resistance tolerance: + - 10% | |
| 150 | Ion pollution degree | ＜1.56ug/cm2 | ＜1.56ug/cm2 | |
| 151 | Warpage | 0.5% (this capability requires that the laminates are consistent, symmetrical, and the difference of symmetrical copper residue rate is within 10%, the wiring is uniform, and the laminates do not contain light plate and single panel) | Single panel ＜ 1.5%, double panel ＜ 0.75% | |
| 152 | IPC standard | Ipc-3 standard (copper thickness, plate thickness, shape, welding ring, plate curvature) | Ipc-2 standard | |
| 153 | Metal package | Non ring metal edging (excluding tin spray plate) | 10mil ring edge (excluding tin spray plate) | |
| 154 | Minimum width of connection bar position: 2mm minimum connection position: 4 places | Minimum width of connecting bar position: 3mm minimum connecting position: 6 places | ||
| 155 | Silk screen serial number | Sure | / | |
| 156 | QR code | Sure | 可以 | |
| 157 | Test | Minimum distance between test point and plate edge | 0.5mm | 0.5mm |
| 158 | Minimum test on resistance | 10Ω | 10Ω | |
| 159 | Test the maximum insulation resistance | 100MΩ | 100MΩ | |
| 160 | Maximum test voltage | 500V | 500V | |
| 161 | Test pad min | 4mil | 4mil | |
| 162 | Minimum spacing between test pads | 4mil | 4mil | |
| 163 | Maximum test current | 200mA | 200mA | |
| 164 | Flying pin test maximum size | 500*900mm | 500*900mm | |
| 165 | Maximum test size of test stand | 600*400mm | 600*400mm | |
| 166 | ||||
| 167 | ||||
| 168 | ||||
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