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Visit：3707   Date：2019-12-26

I refer to different
1. OSP board: A process that complies with RoHS directive requirements for the surface treatment of printed circuit board (PCB) copper foil.
2. PCB: Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components.
Second, the process is different
1. OSP board: It is a chemical method to grow an organic film on the clean bare copper surface. This film has anti-oxidation, thermal shock resistance, and humidity resistance to protect the copper surface from rusting in the normal environment.
2. PCB: It is made by electronic printing.
Third, the use is different
1. OSP board: At high welding temperatures, this protective film must be easily removed by the flux quickly, so that the exposed clean copper surface can be immediately combined with the molten solder in a very short time to become a solid solder joint. .
2. PCB board: After the printed board is used for electronic equipment, due to the consistency of similar printed boards, errors in manual wiring are avoided, and automatic insertion or placement of electronic components, automatic soldering, and automatic detection can be guaranteed to ensure This improves the quality of electronic equipment, improves labor productivity, reduces costs, and facilitates maintenance.